制造工程师

>> 职位信息

  • 发布日期:
  • 2018-04-08
  • 学历要求:
  • 工作经验:
  • 3年以上
  • 截止日期:
  • 2018-05-08
  • 工作地点:
  • 性别要求:
  • 不限
  • 招聘人数:
  • 1人
  • 薪资待遇:
  • 年龄要求:
  • 27岁-35岁
  • 要求专业:
  • 工作方式:
  • 技术职称:
  • 政治面貌:
  • 要求身高:
  • 不限
  • 外语语种:

>> 职位描述

1 JOB OBJECTIVES / SUMMARY
?To ensure engineering capability is established at supplier site during outsourcing process before the start of serial production.
?To drive the improvement solving of modules abnormalities found during FAI, EVT & pre-production
?Be the technical expert know how transfer of assembly instruction & test procedure, tester units, jigs & fixtures to suppliers
?1st level support for CMO suppliers on engineering related issues
?On-site support during the first 2-3 batches of serial production
2 MAIN DUTIES AND RESPONSIBILITIES
?To assess the engineering capabilities of Complete Module Outsourcing (CMO) supplier via qualification or process audit.
?To support Product Qualification Assessment & Process Readiness Audit in order to qualify the suppliers, module readiness identify areas for improvement. Drive suppliers to close the open issues from audit before series production.
?Define the critical parts FAI list to supplier. Drive supplier to solve technical quality issues during FAI, EVT & pre-production.
3 JOB REQUIREMENTS
(Qualification / Education / Years of experience)
?Bachelor in mechanical engineering, electronic engineering, or equivalent with at least 3-5 years of related working experience
?Prefers those with background from semiconductor back-end assembly processes specifically related to die attach or packaging
?Knowledge in die attach, die bonding, die sorting, molding, or singulation
?Familiar with common QC,well verse in geometrical dimensional tolerance (GDT)
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